EES3 Overview
EES3 - The solderable EDGE
As part of the scalable platform, the EES3 combines the advantages of easy and reliable automated manufacturing with high-speed data rates for mobile M2M communication. Offering up to 236 kbps almost all M2M applications can benefit from EDGE coverage worldwide.
- LGA
- EDGE
- TCP/IP
EES3 Details
The EES3 wireless module features:
- LGA 119 pads mounting technology
- EDGE Class 12 for both 236 kbps in uplink and downlink
- GPRS Class 12 for both 86 kbps in uplink and downlink
- Quad-Band (850/9000/1800/1900 MHz)
- TCP/IP over AT
- RIL driver for MS Windows Mobile 6.1 based devices
- USB, I2C, SPI, two serial interfaces
- Extended temperature range: -40°C to +85°C
- Radio Link Stability (RLS) monitoring (e.g. for jamming detection)
- Remote SIM access