Delivering on its promise to continue to invest in research and development and deliver the highest quality modules to the marketplace, Cinterion undertook an extensive research project to determine the best type of surface mount technology (SMT) for machine-to-machine (M2M) applications. Working with independent Siemens technology experts, Cinterion tested, measured and evaluated more than 700 integrated circuits using different surface mount technologies including castellation, ball grid array (BGA) and land grid array (LGA). Engineers employed scientific methods to rigorously perform temperature cycle tests, wetting balance analysis, coplanarity measurement and optical and x-ray inspections. The results indicate that LGA surface mounting with blank pads was the most reliable and flexible SMT for soldering wireless modules into integrated solutions. In addition, LGA technology allows for optimized circuit footprint and pad size with a geometrical layout which proved to be the most versatile allowing customer choice for soldering paste, different grades of overprinting and precise soldering results.