Special geometric pad layout
Special geometric pad layout without pads in the middle and near to the corners of the module eliminates negative warpage effects during reflow processing.

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Improved conductivity
NiAu surface eliminates passivation problems during storing and soldering and improves conductivity and performance of the module.

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Minimized impact on antenna path
Ground pads underneath the RF components minimize the impact on antenna path.

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Customer specific overprinting
Pad size and level pitch enable customer specific overprinting for excellent yield rate and optimal performance.